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Our 3D solder paste inspection (3D SPI) device allows for great convenience and accuracy for our customers. 

Existing 3D image expresses the height as a color map. However, the color 3D solder paste inspection (Color 3D SPI) connects 2D colored images with 3D measuring data to provide detailed and accurate 3D color images, making the operation of equipment much easier.

 

TROITM Series (Solder Paste Inspection) High Speed High Resolution Camera 4 M Pixel, 160 FPS Black and White Camera 2D/3D Shadow Reduction Technology Combination of 2D and 3D LED Lighting eliminates shadow on printed solder. High Accuracy +/- 10um : Ball screw driven stage +/- 5um : Linear X and Y stage Color Enhanced Filter  By using our patented color enhancing algorithm ,  detection height range is a full 0 to 450um.