Automated
Optical Inspection for
Microelectronics
Megapixel color
imaging
High
magnification
top-down viewing camera
Quick set-up
High speed
High defect coverage
Low
false failure rate
Nordson YESTECH's advanced megapixel technology offers high-speed device
inspection with exceptional defect coverage. With high resolution and
telecentric optics, M1m inspects bond wires, die placement, SMT components and
substrates, all within a footprint less than 1 sq. meter. The M1m can be put
in-line with your wire bonders or off-line to support several bonders. A
magazine loader/unloader is available for off-line operations.
Programming the M1m is fast and intuitive. With
CAD data input, a complete recipe can be completed in less than 1 hour*. The
offline programming option allows the engineer
to create complete recipes at
any remote location, without affecting production.